Lattice Semiconductor
ispMACH 4000V/B/C/Z Family Data Sheet
ispMACH 4000Z External Switching Characteristics
Over Recommended Operating Conditions
-35
-37
-42
f MAX
Parameter
t PD
t PD_MC
t S
t ST
t SIR
t SIRZ
t H
t HT
t HIR
t HIRZ
t CO
t R
t RW
t PTOE/DIS
t GPTOE/DIS
t GOE/DIS
t CW
t GW
t WIR
4
f MAX (Ext.)
Description 1, 2, 3
5-PT bypass combinatorial propagation delay
20-PT combinatorial propagation delay
through macrocell
GLB register setup time before clock
GLB register setup time before clock with
T-type register
GLB register setup time before clock, input
register path
GLB register setup time before clock with zero
hold
GLB register hold time after clock
GLB register hold time after clock with T-type
register
GLB register hold time after clock, input
register path
GLB register hold time after clock, input
register path with zero hold
GLB register clock-to-output delay
External reset pin to output delay
External reset pulse duration
Input to output local product term output
enable/disable
Input to output global product term output
enable/disable
Global OE input to output enable/disable
Global clock width, high or low
Global gate width low (for low transparent) or
high (for high transparent)
Input register clock width, high or low
Clock frequency with internal feedback
clock frequency with external feedback,
[1 / (t S + t CO )]
Min.
2.2
2.4
1.0
2.0
0.0
0.0
1.0
0.0
1.5
1.0
1.0
1.0
Max.
3.5
4.4
3.0
5.0
7.0
6.5
4.5
267
192
Min.
2.5
2.7
1.1
2.1
0.0
0.0
1.0
0.0
1.7
1.5
1.5
1.5
Max.
3.7
4.7
3.2
6.0
8.0
7.0
4.5
250
175
Min.
2.7
2.9
1.3
2.6
0.0
0.0
1.3
0.0
2.0
1.8
1.8
1.8
Max.
4.2
5.7
3.5
7.3
8.0
8.0
4.8
220
161
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
MHz
MHz
1. Timing numbers are based on default LVCMOS 1.8 I/O buffers. Use timing adjusters provided to calculate other standards.
2. Measured using standard switching GRP loading of 1 and 1 output switching.
3. Pulse widths and clock widths less than minimum will cause unknown behavior.
4. Standard 16-bit counter using GRP feedback.
24
Timing v.2.2
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